VLSI Technology

Principles and Applications in Engineering Volume: 8

Wai-Kai Chen

400 pages, parution le 15/04/2003

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Résumé

Includes an overview that traces the interrelationship of technology and systems to date, outlines emerging VLSI systems and their requirements, and introduces alternative s Offers expert perspectives on future trends in technology and applications Surveys SiC semiconductor electronics technology, explores its pros and cons, and identifies key crystal growth and device fabrication issues

As their name implies, VLSI systems involve the integration of various component systems. While all of these components systems are rooted in semiconductor manufacturing, they involve a broad range of technologies. This volume of the Principles and Applications of Engineering series examines the technologies associated with VLSI systems, including VLSI processes, semiconductor technology, micromachining, microelectronics packaging, compound semiconductor digital ICs, and multichip modules. Highlights include discussions on relatively recent innovations and progress in areas such as SiGE, SiC, and SOI technologies, noise issues, materials, and logic design.

Contents

VLSI Technology: A System Perspective
CMOS/BiCMOS Technology
Bipolar Technology
Silicon on Insulator Technology
SiGe Technology
SiC Technology
Passive Components
Power IC Technologies
Noise in VLSI Technologies
Micromachining
Microelectronics Packaging
Multichip Module Technologies
Channel Hot Electron Degradation-Delay in MOS Transistors Due to Deuterium Anneal
Materials
Compound Semiconductor Devices for Digital Circuits
Logic Design Principles and Examples
Logic Design Examples

L'auteur - Wai-Kai Chen

University of Illinois, Chicago, Illinois, USA

Caractéristiques techniques

	PAPIER
Éditeur(s)	CRC Press (Taylor and Francis Group)
Auteur(s)	Wai-Kai Chen
Parution	15/04/2003
Nb. de pages	400
Format	18 x 26
Couverture	Relié
Poids	860g
Intérieur	Noir et Blanc
EAN13	9780849317385
ISBN13	978-0-8493-1738-5