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Microchip Fabrication
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Microchip Fabrication

Microchip Fabrication

A practical guide to semiconductor processing

Peter Van Zant

632 pages, parution le 22/01/2000

Résumé

A perfect introduction to the industry that's the backbone of the technology revolution, industry insider Peter Van Zant's Microchip Fabrication is a highly popular, novice-friendly guide to the entire process of semiconductor processing--from raw materials through shipping the finished, packaged device.

Used for training, teaching, and vo-tech programs, and tailor-made for any semiconductor professional, Microchip Fabrication features a straightforward, math-free approach. And it details semiconductors from the inside out, covering science basics, its fascinating history, and the latest technical leap forward.

Inside, you'll follow semiconductors through every stage of fabrication. Testing, manufacturing processes, commercial integrated circuit types, and packaging are all explained in simple, nontechnical language.

Along the way, Van Zant introduces challenging quizzes and review summaries that make Microchip Fabrication an ideal text or self-study guide. By the time you've finished this informative "guided tour," you'll have a solid working knowledge of all the important issues and processes, materials and methods involved in semiconductor technology, whether on the sub-atomic level or in the context of large-scale industrial practices.

Table of contents

Chapter 1: The Semiconductor Industry
Chapter 2: Semiconductor Materials and Process Chemicals
Chapter 3: Manufacturing Wafers
Chapter 4: Overview of Wafer Fabrication
Chapter 5: Contamincation Control
Chapter 6: Process Yields
Chapter 7: Oxidation
Chapter 8: Basic Patterning - Surface Preparation to Exposure
Chapter 9: Basic Patterning - Developing to Final Inspection
Chapter 10: Advanced Photolithography Processes
Chapter 11: Doping
Chapter 12: Deposition
Chapter 13: Metallization
Chapter 14: Process and Device Evaluation
Chapter 15: The Business of Wafer Fabrication
Chapter 16: Semiconductor Devices and Integrated Circuit Formation
Chapter 17: Integrated Circuit Types
Chapter 18: Packaging
Index

Caractéristiques techniques

  PAPIER
Éditeur(s) Mc Graw Hill
Auteur(s) Peter Van Zant
Parution 22/01/2000
Nb. de pages 632
Format 15,5 x 23,5
Couverture Broché
Poids 1161g
Intérieur Noir et Blanc
EAN13 9780071356367

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