Applied Electromagnetics and Electromagnetic Compatibility
Dipak L. Sengupta, Valdis V. Liepa - Collection Wiley Series in Microwave and Optical Engineering
Résumé
Applied Electromagnetics and Electromagnetic Compatibility deals with Radio Frequency Interference (RFI), which is the reception of undesired radio signals originating from digital electronics and electronic equipment. With today's rapid development of radio communication, these undesired signals as well as signals due to natural phenomena such as lightning, sparking, and others are becoming increasingly important in the general area of Electro Magnetic Compatibility (EMC). EMC can be defined as the capability of some electronic equipment or system to be operated at desired levels of performance in a given electromagnetic environment without generating EM emissions unacceptable to other systems operating in the vicinity.
L'auteur - Dipak L. Sengupta
Dipak L. Sengupta, PhD, is Professor Emeritus and Research Scientist at the Radiation Laboratory, Department of Electrical Engineering and Computer Science, University of Michigan, Ann Arbor. He is a Life Fellow of IEEE, and his professional interests are in the areas of antennas, electromagnetics, electromagnetic compatibility, and navigation systems.
L'auteur - Valdis V. Liepa
Valdis V. Liepa, PhD, is a Research Scientist at the Radiation Laboratory, Department of Electrical Engineering and Computer Science, University of Michigan, Ann Arbor, where he works on problems relating to applied electromagnetics and EMC compliance. Dr. Liepa is a Life Member of IEEE.
Sommaire
- General Considerations
- The Electromagnetic Environment
- Fundamentals of Fields and Waves
- Signal Waveform and Spectral Analysis
- Transmission Lines
- Antennas and Radiation
- Behavior of Circuit Components
- Radiated Emissions and Susceptibility
- Electromagnetic Shielding
- Coupling Between Devices
- Electrostatic Discharge (ESD)
- EMC Standards
- Measurements of Emission
- Appendix A: Vectors and Vector Analysis
- Appendix B: Frequency Band Designations
- Appendix C: Constitutive Relations
Caractéristiques techniques
PAPIER | |
Éditeur(s) | Wiley |
Auteur(s) | Dipak L. Sengupta, Valdis V. Liepa |
Collection | Wiley Series in Microwave and Optical Engineering |
Parution | 20/12/2005 |
Nb. de pages | 500 |
Format | 16 x 24 |
Couverture | Relié |
Poids | 800g |
Intérieur | Noir et Blanc |
EAN13 | 9780471165491 |
ISBN13 | 978-0-471-16549-1 |
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